The Lead Free Solder Paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB.
Asia General Series no clean Lead Free Solder Paste were developed according to IPC and JIS standards,and completely coinciding with RoHS directives.Our pastes are composed of environment-friendly flux and low oxidation spherical powder,which were characterized by long continuous repeatability printing time,high print definition,excellent solderability,and bright and smooth solder joint.Special formulation designs deliver excellent rheology and high viscosity retention ability even after extended open time.The wide reflow process window of our products is designed to minimize transition concerns from tin-lead to lead free solder paste.With near transparent and no corrosion residue,our pastes gurantees high surface insulation resistance and offers high in-circuit pin test

Usage:
Phone repair,
PC BGA,
Electronics welding, soldering.